Maintenance mode power supply system

ABSTRACT

A dual mode power device for controlling voltage level to a plasma processing apparatus is disclosed. The dual mode power device comprises a power supply connector and a control circuit. The power supply connector is connected to a first voltage power supply or a second voltage power supply. The control circuit is connected between an output of the power supply connector and a first and second voltage subsystem of the plasma processing apparatus. The control circuit provides a first voltage based on the first voltage power supply to the first voltage subsystem in a first mode of operation of the plasma processing apparatus. The control circuit provides a second voltage based on the second voltage power supply to the second voltage subsystem in a second mode of operation of the plasma processing apparatus.

TECHNICAL FIELD

The present application relates generally to the technical field of apower supply system, and, in various embodiments, to a dual mode powersupply system for powering and maintaining a plasma processingapparatus.

BACKGROUND

Semiconductor processing systems are generally used to processsemiconductor wafers for fabrication of integrated circuits. Forexample, plasma-enhanced semiconductor processes are commonly used inetching, oxidation, and chemical vapor deposition (CVD). Theplasma-enhanced semiconductor processes are typically carried out bymeans of plasma processing systems and generally include a plasmaprocessing chamber to provide a controlled setting.

Conventional plasma processing chambers often include electrostaticchucks (ESCs) to hold wafers (e.g., silicon wafer or substrates) inplace for processing. An electrostatic chuck utilizes electrostaticforce to clamp the wafer to the chuck. A conventional plasma processingsystem includes a plasma processing chamber, a radio frequency (RF)power supply, and an electrostatic chuck power supply.

SUMMARY

In one example embodiment, a dual mode power device comprises a powersupply connector and a control circuit. The power supply is coupled toone of a first voltage power supply or a second voltage power supply.The control circuit is coupled between an output of the power supplyconnector and a first and second voltage subsystem of a plasmaprocessing apparatus. The control circuit provides a first voltage basedon the first voltage power supply to the first voltage subsystem in afirst mode of operation of the plasma processing apparatus. The controldevice provides a second voltage based on the second voltage powersupply to the second voltage subsystem in a second mode of operation ofthe plasma processing apparatus.

In another example embodiment, the first mode of operation includes anoperating mode of the plasma processing apparatus using the firstvoltage. The second mode includes a maintenance mode of the plasmaprocessing apparatus using the second voltage. The operating mode isconfigured to process a wafer disposed in a chamber of the plasmaprocessing apparatus. The maintenance mode is configured to testcomponents of the plasma processing apparatus.

In another example embodiment, the control circuit detects the firstvoltage, provides the first voltage to the first voltage subsystem inthe operating mode, converts the first voltage to the second voltage,and provides the second voltage to the second voltage subsystem in theoperating mode.

In another example embodiment, the power supply connector includes asingle input connector configured to receive one of the first voltagepower supply or the second voltage power supply.

In another example embodiment, the control circuit comprises a firstelectrical circuit and a second electrical circuit. The first electricalcircuit is connected between the output of the power supply connectorand an input of the first voltage subsystem. The second electricalcircuit is connected between the output of the power supply connectorand an input of the second voltage subsystem.

In another example embodiment, the second electrical circuit comprises afuse, a primary surge prevention circuit, a secondary surge preventioncircuit, an inrush protection circuit, a Direct Current (DC) to DCconverter, a first mode circuit, and a diode-based switch circuit. Thefuse is provided as passive fault current protection. The primary surgeprevention circuit is configured to be triggered in response todetecting, on the second electrical circuit, the first voltage generatedby the first voltage power supply. The secondary surge preventioncircuit is coupled to the primary surge prevention circuit. Thesecondary surge prevention circuit is configured to trigger the fuse inresponse to the primary surge prevention circuit failing to operate. Theinrush protection circuit is coupled to the primary and secondary surgeprevention circuits. The inrush protection circuit limits a current fromthe primary and secondary surge prevention circuit. The DC to DCconverter is coupled to the fuse and converts the first voltage to thesecond voltage. The first mode circuit is coupled to the primary surgeprevention circuit. The first mode circuit disables the primary surgeprevention circuit in response to detecting the first voltage generatedby the first voltage power supply. The diode-based switch circuit iscoupled to the inrush protection circuit and the DC to DC converter. Thediode-based switch circuit selects between an output of the inrushprotection circuit and an output of the DC to DC converter.

In another example embodiment, the fuse is configured to disable powerto the second electrical circuit. In another example embodiment, thefuse is configured to disable power to a maintenance voltage path, withthe maintenance voltage path being formed with the primary surgeprevention circuit, the secondary surge prevention circuit, and theinrush protection circuit.

In another example embodiment, the primary surge prevention circuitincludes at least one of a bootstrap current-based surge suppressor withautomatic restart, a bootstrap current-based surge suppressor withoutautomatic restart, a plurality of floating gates, a depletion mode passelement with ground reference control circuit, a depletion mode passelement, or a mechanical relay.

In another example embodiment, the secondary surge prevention circuitincludes at least one of a clamp circuit, a shunt voltage regulator, ora shunt transistor switch.

In another example embodiment, an output of the DC to DC converter isused to disable the primary surge prevention circuit or the inrushprotection circuit.

In another example embodiment, an output of the secondary surgeprevention circuit is used to disable the primary surge preventioncircuit or the inrush protection circuit.

In another example embodiment, an input voltage at the fuse is used toturn off the primary surge prevention circuit in response to the inputvoltage corresponding to the first voltage of the first voltage powersupply.

In another example embodiment, the dual mode power device furthercomprises a RF filter and a switch. The RF filter is disposed betweenthe output of the power supply connector and the control circuit. The RFfilter filters signals from the first voltage power supply. The switchis coupled to the first voltage power supply and the second voltagepower supply. The switch connects the first voltage power supply to thecontrol circuit in the first mode of operation, and the second voltagepower supply to the control circuit in the second mode of operation.

In another example embodiment, the first voltage is more than 300 Volts,wherein the second voltage is less than 15 Volts.

BRIEF DESCRIPTION OF THE DRAWINGS

Some embodiments of the present invention are illustrated by way ofexample and not limitation in the figures of the accompanying drawings,in which like reference numbers indicate similar elements and in which:

FIG. 1A is a block diagram depicting a plasma chamber system connectedto a high voltage power supply, according to an example embodiment;

FIG. 1B is a block diagram depicting a plasma chamber system connectedto a low voltage power supply, according to an example embodiment;

FIG. 2 is a block diagram depicting an example embodiment of a dual modecontrol circuit;

FIG. 3 is a flowchart illustrating an example embodiment of a method foroperating a control circuit in an operating mode; and

FIG. 4 is a flowchart illustrating an example embodiment of a method foroperating a control circuit in a maintenance mode.

DETAILED DESCRIPTION

The description that follows includes illustrative systems, methods,techniques, instruction sequences, and computing machine programproducts that embody illustrative embodiments. In the followingdescription, for purposes of explanation, numerous specific details areset forth in order to provide an understanding of various embodiments ofthe inventive subject matter. It will be evident, however, to thoseskilled in the art that embodiments of the inventive subject matter maybe practiced without these specific details. In general, well-knowninstruction instances, protocols, structures, and techniques have notbeen shown in detail.

The present disclosure describes a dual mode power device forcontrolling voltage level to a plasma processing apparatus (e.g., plasmaprocessing chamber for processing wafers). Conventionally, separatepower connectors and wiring are used for maintenance mode (low voltage)and normal operating mode (high voltage) in a plasma processingapparatus. Thus, the plasma processing apparatus can include a firstpower supply input connector connected to a first set of wires used forthe high voltage power, and a second power supply input connectorconnected to a second set of wires used for the low voltage power. Theadditional wiring (from the combined first and second set of wires andthe combined first and second power supply input connectors) increasesthe physical complexity of the plasma processing apparatus by utilizinglimited physical space in the plasma processing chamber. The additionalwiring can also degrade performance of a RF filter disposed between theplasma processing chamber and the power supply input connectors. It maybe difficult to incorporate separate low voltage wires and connectorsbecause of the RF filtering components between the ESC and the powersupply input connectors. An RF feed-rod from the RE filter utilizesadditional space to route these additional wires. Furthermore, amaintenance technician of the plasma processing apparatus could also beexposed to high voltage on the low voltage connector if the insulationfailure causes high voltage to leak through to the low voltage wires.

The present disclosure describes a dual mode control circuit thatenables testing of low voltage subsystems (e.g., heater elements)installed in the ESC area of the plasma processing chamber with saferlow voltage power instead of the high voltage power supplied duringnormal operation. The low voltage is connected to a single power supplyconnector during maintenance mode using the same wires and connectors.As such, the same power supply connector can be connected to either thehigh voltage power supply or the low voltage power supply. In oneexample embodiment, a switch may couple the high voltage power supplyand the low voltage power supply to the same power supply connector. Theswitch can thus switch between the high voltage power supply or the lowvoltage power supply.

The dual mode control circuit provides high voltage to high voltagesubsystems (e.g., antenna coil, heater element, ESC) for normaloperation and, through mode switching control, provides a safe lowvoltage during maintenance mode. The dual model control circuit detectslow voltage desired for the maintenance mode and powers the low voltagepower subsystem of the plasma processing chamber with the low voltage.When the control circuit detects high voltage at the single power supplyconnector desired for normal operation, the control circuit prevents thehigh voltage from reaching the low voltage power subsystem of the plasmaprocessing chamber by converting the high voltage to the low voltage andby providing the low voltage to the low voltage power subsystem,

FIG. 1A is a block diagram depicting an arrangement 100 comprising aplasma chamber system 110 with a (single) power supply connector 105connected to a high voltage power supply 102, according to an exampleembodiment. High voltage wires 101 connect the high voltage power supply102 to an input of the power supply connector 105. The high voltagepower supply 102 is configured to generate a high voltage power (e.g,,more than 300 Volts). The low voltage power supply 104 is connected tolow voltage wires 103. The input of the power supply connector 105 canbe physically connected to only one of the wires 101 or 103. FIG. 1Aillustrates the power supply connector 105 being connected only to thehigh voltage power supply 102 and not the low voltage power supply 104.Therefore, high voltage wires 101 are physically plugged into the inputof the power supply connector 105. To switch voltage supply, an operatoror user of the plasma chamber system 110 would manually unplug the highvoltage wires 101 from the input of the power supply connector 105, andmanually plug the low voltage wires 103 to the input of the power supplyconnector 105.

In another example embodiment, both the high voltage power supply 102and the lower voltage power supply 104 are connected to a switch (notshown) that is connected to the input of the power supply connector 105.The switch connects either the high voltage power supply 102 or the lowvoltage power supply 104 to the input of the power supply connector 105.

The plasma chamber system 110 includes an RE filter 106, a dual modecontrol circuit 108, a high voltage power subsystem 112, and a lowvoltage power subsystem 114. The RF filter 106 is connected to an outputof the power supply connector 105 and filters radio frequencies from thehigh voltage power generated by the high voltage power supply 102. Anoutput of the RE filter 106 is connected to the dual mode controlcircuit 108.

The dual mode control circuit 108 detects the high voltage power fromthe power supply connector 105 and provides the high voltage power tothe high voltage power subsystem 112. In another example embodiment, thedual mode control circuit 108 detects the high voltage power from thepower supply connector 105, converts the high voltage power to a lowvoltage power, and provides the low voltage power to the low voltagepower subsystem 114.

The dual mode control circuit 108 controls whether high voltage power orlow voltage power is provided to the high voltage power subsystem 112 orthe low voltage power subsystem 114 based on an operating mode of theplasma chamber system 110. For example, the dual mode control circuit108 enables high voltage power to be provided to the high voltage powersubsystem 112 in a normal operating mode. The high voltage powersubsystem 112 includes high voltage components that enable the plasmachamber system 110 to process a wafer with plasma. For example, the highvoltage components include coils, heater elements, and the ESC. Thenormal operating mode includes a mode suitable for powering the highvoltage components of the high voltage power subsystem 112 to processthe wafer with plasma.

The dual mode control circuit 108 also enables low voltage power to beprovided to the low voltage power subsystem 114 in a maintenance mode.The low voltage power subsystem 114 includes low voltage components usedfor testing and calibrating low voltage components. For example, the lowvoltage components include heater control circuits and heater elementsin the chamber of the plasma chamber system 110. The maintenance modeincludes, for example, a mode suitable for powering and testing the lowvoltage components of the low voltage power subsystem 114. In oneexample embodiment, the high voltage power subsystem 112 and the lowvoltage power subsystem 114 share some of the same elements (e.g.,heater control circuits, heater elements) that are respectively used fordifferent purposes in the normal operating mode and the maintenancemode. In another example, elements from the low voltage power subsystem114 are distinct from elements from the high voltage power subsystem112.

FIG. 1B is a block diagram depicting an arrangement 150 comprising theplasma chamber system 110 with the (single) power supply connector 105connected to the low voltage power supply 104 (and not to the highvoltage power supply 102), according to an example embodiment. Lowvoltage wires 103 connect the low voltage power supply 104 to an inputof the power supply connector 105. The low voltage power supply 104 isconfigured to generate a low voltage power (e.g., less than 15 Volts).

The dual mode control circuit 108 detects the low voltage power from thepower supply connector 105 and provides the low voltage power to the lowvoltage power subsystem 114. In one example embodiment, when the dualmode control circuit 108 detects the low voltage power, the dual modecontrol circuit 108 determines a maintenance mode (based on measuringthe low voltage power) and does not provide any power to the highvoltage power subsystem 112.

FIG. 2 is a block diagram depicting an example embodiment of the dualmode control circuit 108. The dual mode control circuit 108 includes ahigh voltage circuit 205 and a low voltage circuit 206. During thenormal operating mode, the high voltage circuit 205 provides highvoltage power from the high voltage power supply 102 (via an output ofthe RF filter 106) to the high voltage power subsystem 112. The lowvoltage circuit 206 protects the low voltage power subsystem 114 fromthe high voltage power during the normal operating mode. During themaintenance mode, the low voltage circuit 206 connects the low voltagepower supply 104 (via the output of the RF filter 106) to the lowvoltage power subsystem 114.

In one example embodiment, the low voltage circuit 206 includes a fuse208, a first low voltage path 223, and a second low voltage path 224.The fuse 208 is configured to be break an electric circuit when highvoltage power is detected on the low voltage circuit 206. In one exampleembodiment, high voltage power is removed from both the first lowvoltage path 223 and the second low voltage path 224. In another exampleembodiment, high voltage power is removed from the second low voltagepath 224 while the high voltage power can flow through the first lowvoltage path 223 to a DC to DC converter 210.

In another example embodiment, a diode or circuit could be used toprovide the low maintenance mode input voltage to both the high and lowvoltage sub-systems. Separate high voltage and low voltage wires wouldhave to be run through the filter up to the diode circuit. Therefore,the filter 106 would have both high voltage and low voltage inputs andoutputs.

The first low voltage path 223 includes the DC to DC converter 210 and adiode-based switching circuit 218. The DC to DC converter 210 convertshigh voltage power to low voltage power. In one example embodiment, theDC to DC converter 210 includes input voltage monitoring, over currentprotection, and programmable output voltage features. The diode-basedswitching circuit 218 includes a switching circuit low loss diode-basedswitching circuit) that automatically selects either the output of firstlow voltage path 223 or the output of the second low voltage path 224 toprovide low voltage power to the low voltage power subsystem 114.

The second low voltage path 224 includes a primary surge preventioncircuit 212, a secondary surge prevention circuit 214, and an inrushprotection circuit 216. The primary surge prevention circuit 212 isconnected to the fuse 208. The primary surge prevention circuit 212operates in three modes: (1) it provides low voltage present inmaintenance mode with low loss; (2) it regulates intermediate voltagesdown to a safer lower voltage; and (3) it turns off during normaloperation when high voltage is present. In one example embodiment, theprimary surge prevention circuit 212 includes a bootstrap current basedsurge suppressor (e.g., integrated floating charge pump gate voltagegenerator with automatic restart from input voltage glitches). In otherexample embodiments, the primary surge prevention circuit 212 includesan integrated floating charge pump gate voltage generator withoutautomatic restart, a separate floating gate voltage generator, anover-voltage comparator, a voltage regulation circuit, a depletion modeN or P-channel FET or PNP pass element with ground reference controlcircuit, a depletion mode FET pass element, or a mechanical relay.

The secondary surge prevention circuit 214 includes a clamp circuit thatdraws current large enough to trigger the fuse 208 if the primary surgeprevention circuit 212 fails. In other example embodiments, the outputof the secondary surge prevention circuit 214 is used to reset ordisable the primary surge prevention circuit 212. The secondary surgeprevention circuit 214 includes, for example, a TVS-based clamp withhigh current capability sufficient to trigger the fuse 208 withavailable fault current. In other example embodiments, the secondarysurge prevention circuit 214 includes an over voltage crowbar protectioncircuit (SCR-based crowbar), a shunt voltage regulator, or a shunttransistor switch.

The inrush protection circuit 216 is connected to an output of thesecondary surge prevention circuit 214 through a filter 222. The inrushprotection circuit 216 limits current and turns off the current when theoutput voltage from the secondary surge prevention circuit 214 (e.g.,clamp circuit) is too high during a normal operating mode. The output ofinrush protection circuit 216 provides low voltage power during themaintenance mode. In one example embodiment, the inrush protectioncircuit 216 includes circuit breaker function, over voltage lock-out,under voltage lock-out, and soft start features. In another exampleembodiment, the output of the secondary surge prevention circuit 214 isused to turn off the inrush protection circuit 216 via its over-voltageinput or under-voltage input. In other example embodiments, no inrushprotection circuit 216 is used and the second low voltage path 224 doesnot include the inrush protection circuit 216.

FIG. 3 is a flowchart illustrating an example embodiment of a method 300for operating the dual mode control circuit 108. At operation 302, thedual mode control circuit 108 determines that the plasma chamber system110 is operating in the normal operating mode (e.g., by measuring a highvoltage level input to the dual mode control circuit 108). At operation304, the dual mode control circuit 108 provides the high voltage powerfrom the high voltage power supply 102 to the high voltage powersubsystem 112. At operation 308, the dual mode control circuit 108protects the low voltage power subsystem 114 by converting the highvoltage power to the low voltage power with a power converter (e.g., DCto DC converter 210). At operation 310, the dual mode control circuit108 provides the low voltage power to the low voltage power subsystem114. In an alternative embodiment, the dual mode control circuit 108protects the low voltage power subsystem 114 by preventing any powerfrom reaching the low voltage power subsystem 114 by using thecomponents of the low voltage circuit 206.

FIG. 4 is a flowchart illustrating another example embodiment of amethod 400 for operating the dual mode control circuit 108. At operation402, the dual mode control circuit 108 determines that the plasmachamber system 110 is operating in the maintenance mode (e.g., bymeasuring a low voltage input to the dual mode control circuit 108). Atoperation 404, the dual mode control circuit 108 provides the lowvoltage power from the low voltage power supply 104 to the low voltagepower subsystem 114. In one example embodiment, the dual mode controlcircuit 108 does not provide any power to the high voltage powersubsystem 112. In another example embodiment, the dual mode controlcircuit 108 provides the low voltage power to both the low voltage powersubsystem 114 and the high voltage power subsystem 112. The low voltagepower is not high enough to generate plasma inside the chamber. Thus, amaintenance worker would not be subjected to hazardous conditionsbecause of the low voltage power.

The description above includes illustrative examples, devices, systems,and methods that embody the disclosed subject matter. In thedescription, for purposes of explanation, numerous specific details wereset forth in order to provide an understanding of various embodiments ofthe disclosed subject matter. It will be evident, however, to those ofordinary skill in the art that various embodiments of the subject mattermay be practiced without these specific details. Further, well-knownstructures, materials, and techniques have not been shown in detail, soas not to obscure the various illustrated embodiments.

As used herein, the term “or” may be construed in an inclusive orexclusive sense. Further, other embodiments will be understood by aperson of ordinary skill in the art upon reading and understanding thedisclosure provided. Further, upon reading and understanding thedisclosure provided herein, the person of ordinary skill in the art willreadily understand that various combinations of the techniques andexamples provided herein may all be applied in various combinations.

Although various embodiments are discussed separately, these separateembodiments are not intended to be considered as independent techniquesor designs. As indicated above, each of the various portions may beinterrelated and each may be used separately or in combination withother particulate matter sensor calibration system embodiments discussedherein.

Consequently, many modifications and variations can be made, as will beapparent to the person of ordinary skill in the art upon reading andunderstanding the disclosure provided herein. Functionally equivalentmethods and devices within the scope of the disclosure, in addition tothose enumerated herein, will be apparent to the skilled artisan fromthe foregoing descriptions. Portions and features of some embodimentsmay be included in, or substituted for, those of others. Suchmodifications and variations are intended to fall within a scope of theappended claims. Therefore, the present disclosure is to be limited onlyby the terms of the appended claims, along with the full scope ofequivalents to which such claims are entitled. It is also to beunderstood that the terminology used herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting.

The Abstract of the Disclosure is provided to allow the reader toquickly ascertain the nature of the technical disclosure. The abstractis submitted with the understanding that it will not be used tointerpret or limit the claims. In addition, in the foregoing DetailedDescription, it may be seen that various features may be groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted aslimiting the claims. Thus, the following claims are hereby incorporatedinto the Detailed Description, with each claim standing on its own as aseparate embodiment.

What is claimed is:
 1. A dual mode power device comprising: a power supply connector configured to he coupled with one of a first voltage power supply or a second voltage power supply; and a control circuit coupled between an output of the power supply connector and a first and second voltage subsystem of a plasma processing apparatus, the control circuit configured to: provide a first voltage based on the first voltage power supply to the first voltage subsystem in a first mode of operation of the plasma processing apparatus in response to the power supply connector being connected to the first voltage supply, and provide a second voltage based on the second voltage power supply to the second voltage subsystem in a second mode of operation of the plasma processing apparatus in response to the power supply connector being connected to the second voltage power supply.
 2. The dual mode power device of claim I, wherein the first mode of operation includes an operating mode of the plasma processing apparatus using the first voltage, wherein the second mode of operation includes a maintenance mode of the plasma processing apparatus using the second voltage.
 3. The dual mode power device of claim 2, wherein the operating mode is configured for processing a wafer disposed in a chamber of the plasma processing apparatus, wherein the maintenance mode is configured for testing or calibrating components of the plasma processing apparatus.
 4. The dual mode power device of claim 2, wherein the control circuit is configured to: detect the first voltage in response to the power supply connector being connected to the first voltage supply, provide the first voltage to the first voltage subsystem in the operating mode, convert the first voltage to the second voltage, and provide the second voltage to the second voltage subsystem in the maintenance mode.
 5. The dual mode power device of claim 1, wherein the power supply connector includes a single input connector configured to receive one of the first voltage power supply or the second voltage power supply.
 6. The dual mode power device of claim 2, wherein the control circuit further comprises: a first electrical circuit connected between the output of the power supply connector and an input of the first voltage subsystem; and a second electrical circuit connected between the output of the power supply connector and an input of the second voltage subsystem.
 7. The dual mode power device of claim 6, wherein the second electrical circuit comprises: a fuse configured to break the second electrical circuit in response to detecting, on the second electrical circuit, the first voltage generated by the first voltage power supply; a primary surge prevention circuit coupled to the fuse, the primary surge prevention circuit configured to be disabled in the first mode of operation, and to be enabled in the second mode of operation; a secondary surge prevention circuit coupled to the primary surge prevention circuit; an inrush protection circuit coupled to the primary and secondary surge prevention circuits, the inrush protection circuit configured to limit a current from the primary and secondary surge prevention circuit; a Direct Current (DC) to DC converter coupled to the fuse, the DC to DC converter configured to convert the first voltage to the second voltage; a first mode circuit coupled to the primary surge prevention circuit, the first mode circuit configured to disable the primary surge prevention circuit in response to detecting the first voltage generated by the first voltage power supply; and a diode-based switch circuit coupled to the inrush protection circuit and the DC to DC converter, the diode-based switch circuit configured to select between an output of the inrush protection circuit and an output of the DC to DC converter.
 8. The dual mode power device of claim 7, wherein the fuse is configured to disable power to the second electrical circuit.
 9. The dual mode power device of claim 7, wherein the DC to DC converter is powered by the first voltage power supply in the first mode of operation.
 10. The dual mode power device of claim 7, wherein the primary surge prevention circuit includes at least one of a bootstrap current-based surge suppressor with automatic restart, a bootstrap current-based surge suppressor without automatic restart, a plurality of floating gates, a depletion mode pass element with ground reference control circuit, a depletion mode pass element, or a mechanical relay.
 11. The dual mode power device of claim 7, wherein the secondary surge prevention circuit includes at least one of a clamp circuit, a shunt voltage regulator, or a shunt transistor switch.
 12. The dual mode power device of claim 7, wherein an output of the DC to DC converter is used to disable the primary surge prevention circuit or the inrush protection circuit.
 13. The dual mode power device of claim 7, wherein an output of the secondary surge prevention circuit is used to disable the primary surge prevention circuit or the inrush protection circuit.
 14. The dual mode power device of claim 7, wherein an input voltage at the fuse is used to turn off the primary surge prevention circuit in response to the input voltage corresponding to the first voltage of the first voltage power supply.
 15. The dual mode power device of claim 6, further comprising: a radio frequency (RF) filter disposed between the output of the power supply connector and the control circuit, the RF frequency filter configured to filter signals from the first voltage power supply; and a switch coupled to the first voltage power supply and the second voltage power supply, the switch being configured to connect the first voltage power supply to the control circuit in the first mode of operation, and the second voltage power supply to the control circuit in the second mode of operation.
 16. The dual mode power device of claim 1, wherein the first voltage is more than 300 Volts, wherein the second voltage is less than 15 Volts.
 17. A dual mode power source system comprising: a first voltage power supply for generating a first voltage for powering a first voltage subsystem of a plasma processing apparatus, the first voltage subsystem being configured to operate based on the first voltage in a first mode of operation of the plasma processing apparatus; a second voltage power supply for generating a second voltage for powering a second voltage subsystem of the plasma processing apparatus, the second voltage subsystem being configured to operate based on the second voltage in a second mode of operation of the plasma processing apparatus; and a control circuit having an input configured to receive signals from one of the first voltage power supply and the second voltage power supply, and an output of the control circuit coupled to the second voltage subsystem, the control circuit being configured to: protect the second voltage subsystem from the first voltage power supply during the first mode of operation in response to the input receiving signals from the first power voltage supply; prevent the first voltage power supply from powering the second voltage subsystem in the second mode of operation in response to the input receiving signals from the first power voltage supply; and allow the second voltage power supply to power both first voltage subsystem and the second voltage subsystem.
 18. The dual mode power device of claim 17, wherein the first mode of operation includes an operating mode of the plasma processing apparatus using the first voltage, wherein the second mode of operation includes a maintenance mode of the plasma processing apparatus using the second voltage.
 19. The dual mode power device of claim 18, wherein the operating mode is configured to process a wafer disposed in a chamber of the plasma processing apparatus, wherein the maintenance mode is configured to test or calibrate components of the plasma processing apparatus.
 20. The dual mode power device of claim 18, wherein the control circuit is configured to: detect the first voltage in response to the input receiving signals from the first power voltage supply, provide the first voltage to the first voltage subsystem in the operating mode, convert the first voltage to the second voltage, and provide the second voltage to the second voltage subsystem in the operating mode. 